Shear induced deformation twinning evolution in thermoelectric InSb
Zhongtao Lu, Ben Huang, Guodong Li, Xiaolian Zhang, Qi An, Bo Duan, Pengcheng Zhai, Qingjie Zhang, William A. Goddard III
Abstract
Twin boundary (TB) engineering has been widely applied to enhance the strength and plasticity of metals and alloys, but is rarely adopted in thermoelectric (TE) semiconductors. Our previous first-principles results showed that nanotwins can strengthen TE Indium Antimony (InSb) through In–Sb covalent bond rearrangement at the TBs. Herein, we further show that shear-induced deformation twinning enhances plasticity of InSb. We demonstrate this by employing large-scale molecular dynamics (MD) to follow the shear stress response of flawless single-crystal InSb along various slip systems. We observed that the maximum shear strain for the (111)[112¯] slip system can be up to 0.85 due to shear-induced deformation twinning. We attribute this deformation twinning to the "catching bond" involving breaking and re-formation of In–Sb bond in InSb. This finding opens up a strategy to increase the plasticity of TE InSb by deformation twinning, which is expected to be implemented in other isotypic III–V semiconductors with zinc blende structure.
Group Members
Lu, Z., Huang, B., Li, G., Zhang, X., An, Q., Duan, B., Zhai, P., Zhang, Q., & III, W. A. G. (2021). Shear induced deformation twinning evolution in thermoelectric InSb. *npj Computational Materials*, *7*, Art. No. 111. https://doi.org/10.1038/s41524-021-00581-x